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Semiconductor solutions

Advanced semiconductor packaging, non-silicon-based MEMS (Micro nano LDI equipment, Materials and Processes)

 
Application
Single crystal piezoelectric film deposition
Single crystal piezoelectric film deposition High temperature and high vacuum degree, can realize the deposition of single crystal piezoelectric film, compatible with Si-based CMOS process
Wafer-level packaging lithography machine
Wafer-level packaging lithography machine The projection lithography system with large depth of field and real-time focus greatly improves the yield of FOWLP and SIP packages.
Non-silicon-based MEMS lithography machine
Non-silicon-based MEMS lithography machine Double-sided Panel/R2R projection lithography system with high alignment accuracy and capacity

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GIS Semiconductors Inc.


+86 199 5132 0170
+86 (0)512-66579218
mk@gis-group.com.cn

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